What filler metal is used for brazing copper-to-copper joints?

The filler metal used for brazing copper-to-copper joints is the BCuP-Series. This series specifically includes copper-phosphorus alloys that are ideal for braze welding copper. The BCuP-Series alloys have a lower melting point than copper, making them suitable for joining copper components without causing significant thermal distortion or damage to the base materials.

Brazing with BCuP-Series alloys creates strong joints due to the inherent properties of the alloy, such as good fluidity and wetting characteristics. These features ensure that the filler metal can flow into the joint, filling in gaps and ensuring a robust bond when cooled.

Other choices, while possible for different applications or materials, do not specifically cater to the typical requirements for copper-to-copper brazing. For instance, aluminum-silicon alloys are primarily used with aluminum materials, while silver solder, although capable of joining copper, is generally not as practical for larger joints compared to BCuP-Series brazing materials, which are specifically formulated for copper applications.